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7-inch Diamond Metal Bond Wafering Blades, Low Concentration, ( 15.875mm Arbor ), Each

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7-inch Diamond Metal Bond Wafering Blades, Low Concentration, ( 15.875mm Arbor ), Each image
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Technical Specifications

Cutting Wheels
Abrasive Material Metal Bond
Composition Bond Low Concentration
Recommended For For cutting of hard and brittle materials (750 < HV < 2000)
Wheel Arbor 0.625-inch
Wheel Diameter 7-inch
Wheel Thickness 0.015-inch
7-inch Diamond Metal Bond Wafering Blades, Low Concentration, ( 15.875mm Arbor ), Each
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  • Stock: 1000
  • Model: WB-7-L15
  • Weight: 1.10lb
  • SKU: WB-7-L15
190 samples sold

7" Diamond Blades Series (5/8" Arbor)

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7-inch CBN Resin Bond Wafering Blades, High Concentration, ( 15.875mm Arbor ), Each

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7-inch Diamond Resin Bond Wafering Blades High Concentration, ( 15.875mm Arbor ), Each

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Quantity Discount

Qty New Price Saving Discount
10+ When registered your discount start with just buying 1 -10%
5+ When registered your discount start with just buying 1 -5%
1+ When registered your discount start with just buying 1 -3%

Diamond Metal Bond Blades Low Concentration are composed of an inner metal core and an outer rim. The rim consists of metal mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability. Diamond Blades Low Concentration are recommended for cutting brittle materials that would be found with certain glasses and ceramics, also for ceramics, glass, alumina, zirconia, concrete, electronic substrates. Also recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized.

Diamond Cut-off Wheel for precision cutting of ceramics and minerals. For use with hard/brittle materials such as Glass, Al203, Zr203, Concrete, hard/tough materials structural ceramics, boron carbide, boron nitride, and silicon carbides. 

For cutting of hard and brittle materials (750 < HV < 2000)
For cutting of ceramics and minerals (750 < HV < 2000)
For cutting of sintered carbides and ceramics (750 < HV < 2000)
         

Materials recommended for cutting Diamond Metal Bond Blades Low Concentration:

Brittle materials that would be found with certain glasses and ceramics, also for ceramics, glass, alumina, zirconia, concrete, electronic substrates.

Also recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized.

Diamond Cut-off Wheel for precision cutting of ceramics and minerals. For use with hard/brittle materials such as Glass, Al203, Zr203, Concrete, hard/tough materials structural ceramics, boron carbide, boron nitride, and silicon carbides. 

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